| Characteristic | 符号 | TLP621−2 | 单位 |
| TLP621 | TLP621−4 | |
| Forward current | IF 60 | 50 | mA |
| Forward current derating | (Note 1) ΔIF /°C −0.7 (Ta ≥ | 39°C) −0.5 (Ta ≥ 25°C) | mA /°C |
| Pulse forward current | IFP 1 | (100μs pulse, 100pps) | A |
| Power dissipation | PD 100 | 70 | mW |
| Power dissipation derating | ΔPD /°C −1.0(Ta ≥ | 39°C) −0.7(Ta ≥ 25°C) | mW /°C |
| Junction temperature | Tj | 125 | °C |
| Collector−emitter voltage | VCEO | 55 | V |
| Emitter−collector voltage | VECO | 7 | V |
| Collector current | IC | 50 | mA |
| (1 circuit) | PC 150 | 100 | mW |
| ΔPC /°C −1.5 | −1.0 | mW /°C |
| (1 circuit, Ta ≥ 25°C) | | | |
| Junction temperature | Tj | 125 | °C |
| Storage temperature range | Tstg | −55 to 125 | °C |
| Operating temperature range | Topr | −55 to 100 | °C |
| Lead soldering temperature | Tsol | 260 (10 s) | °C |
| Total package power dissipation | PT 250 | 150 | mW |
| Total package power dissipation | derating | | |
| (Ta ≥ 25°C) | ΔPT /°C −2.5 | −1.5 | mW /°C |
| Isolation voltage | (Note 2) BVS 5000 | (AC, 60 s., R.H.≤ 60 %) | Vrms |