| 特性 | 符号 | 单位 |
|---|
| TLP627 | TLP627-2 TLP627-4 |
| Forward Current | IF 60 | 50 mA |
| Forward Current Derating | ∆IF /°C -0.7(Ta≥39°C) | -0.5(Ta≥25°C) mA /°C |
| Pulse Forward Current | IFP 1 (100μs | pulse,100pps) A |
| Diode Power Dissipation | (1 Circuit) PD 100 | 70 mW |
| Diode Power Dissipation Derating | (1 Circuit) ∆ PD /°C -1.2 (Ta≥39°C) | -0.7 (Ta≥25°C) mW /°C |
| Collector-Emitter Voltage | VCEO | 300 V |
| Emitter -Collector Voltage | VECO | 0.3 V |
| Collector Current | IC | 150 mA |
| Collector Power Dissipation | (1 Circuit) PC 150(300(Note 1)) | 100 mW |
| Collector Power Dissipation Derating (Ta≥25°C,1 | Circuit) ∆ P C / °C -1.5(-3.5(Note 1)) | -1.0 mW /°C |
| Operating Temperature Range | Topr -55 | to 100 °C |
| Storage Temperature Range | Tstg -55 | to 125 °C |
| Lead Soldering Temperature | Tsol | 260(10s) °C |
| Total Package Power Dissipation | (1 Circuit) PT 250(320(Note 1)) | 150 mW |
| Total Package Power Dissipation Derating (Ta≥25°C,1 | Circuit) ∆ PT/°C -2.5(-3.2(Note 1)) | -1.5 mW /°C |
| Isolation Voltage (AC,60 s, R.H. ≤ 60%) | (Note 2) BVS | 5000 Vrms |
