产品应用与封装尺寸
图纸取自原厂规格书，点击可放大查看原始尺寸标注。
产品特点 Features
- n Small and flat lead SMD plastic package n Low leakage current
- BAS116H
- 75 V, low leakage diode in small SOD123F package
- 2. Pinning information
- Table 2: Pinning
- 6. Thermal characteristics
- Table 6: Thermal characteristics
- Symbol Parameter Conditions Min Typ Max Unit
- R thermal resistance from in free air [1][2] - - 330 K/W th(j-a) junction to ambient
- R thermal resistance from - - 70 K/W th(j-sp) junction to solder point
- [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
- [2] Reflow soldering is the only recommended soldering method.
- 7. Characteristics
- Table 7: Characteristics
- T = 25 C unless otherwise specified.
- Per diode