| Characteristic | 符号 | 额定值 | 单位 |
| Forward current | IF | 50 | mA |
| Forward current derating (Ta ≥ 90°C) | ΔIF/°C | -1.5 | mA/°C |
| Pulse forward current | (Note 1) IFP | 1 | A |
| Diode power dissipation | PD | 100 | mW |
| Diode power dissipation derating (Ta >90°C) | ΔPD/°C | -2.9 | mW/°C |
| Junction temperature | Tj | 125 | °C |
| Collector-emitter voltage | VCEO | 80 | V |
| Emitter-collector voltage | VECO | 7 | V |
| Collector current | IC | 50 | mA |
| Collector power dissipation | PC | 150 | mW |
| Collector power dissipation derating (Ta ≥ | 25°C) ΔPC/°C | -1.5 | mW/°C |
| Junction temperature | Tj | 125 | °C |
| Operating temperature range | Topr | -55 to 110 | °C |
| Storage temperature range | Tstg | -55 to 125 | °C |
| Lead soldering temperature (10 s) | Tsol | 260 | °C |
| Total package power dissipation | PT | 200 | mW |
| Total package power dissipation derating (Ta ≥ | 25°C) ΔPT/°C | -2.0 | mW/°C |
| Isolation voltage (AC, 60 s, R.H. ≤ 60 %) | (Note 2) BVS | 3750 | Vrms |