产品应用与封装尺寸


图纸取自原厂规格书,点击可放大查看原始尺寸标注。
引脚定义与内部结构
| 引脚 | 符号 | 名称 |
|---|---|---|
| 3 | O | |
| 4 | RECOGNITION | |
| 5 | GND | |
| 6 | V | |
| 7 | V | |
| 8 | V |
数据来源:原厂规格书引脚图
关键参数速览
- 电源电压 VCC
- 18
- 工作温度 TA
- 85
产品特点 Features
- Selection for lower input current down to 250 μA is footprint area of the standard dual-in-line package. The available upon request. lead profi le is designed to be compatible with standard surface mount processes.
- The HCPL-0701 and HCPL-0700 are surface mount devices packaged in an industry standard SOIC-8 footprint. The HCNW139 and HCNW138 are packaged in a widebody encapsulation that provides creep age and
- The SOIC-8 does not require “through holes” in a PCB.
绝对最大额定值 Absolute Maximum Ratings(TA = 25°C)
超过下表数值可能造成器件永久损坏,设计时请留余量。
| 参数 | 符号 | 最小 | 最大 | 单位 |
|---|---|---|---|---|
| Storage Temperature | T | -55 | 125 | °C |
| Operating Temperature** | T | -40 | 85 | °C |
| Average Forward Input Current | I | 20 | mA | |
| Peak Forward Input Current | I | 40 | mA | |
| Peak Transient Input Current | I | 1.0 | A | |
| HCNW139/138 | 3 | V | ||
| Input Power Dissipation | P | 35 | mW | |
| Output Current (Pin 6) | I | 60 | mA | |
| Output Power Dissipation | P | 100 | mW | |
| Total Power Dissipation | P | 135 | mW | |
| HCNW139/138 260°C for | 10 sec., up to | seating plane |
数据来源:原厂规格书
安全与绝缘额定值(DIN EN/IEC 60747−5−5)
| 参数 | 符号 | 值 | 值2 | 值3 | 单位 | 条件 |
|---|---|---|---|---|---|---|
| 8-Pin DIP | Widebody | |||||
| (300 Mil) | SO-8 | (400 Mil) | ||||
| Minimum External | L(101) | 7.1 | 4.9 | 9.6 | mm | Measured from input terminals |
| Air Gap (External | to output terminals, shortest | |||||
| Clearance) | distance through air. | |||||
| Minimum External | L(102) | 7.4 | 4.8 | 10.0 | mm | Measured from input terminals |
| Tracking (External | to output terminals, shortest | |||||
| Creepage) | distance path along body. | |||||
| Minimum Internal | 0.08 | 0.08 | 1.0 | mm | Through insulation distance, | |
| Plastic Gap | conductor to conductor, usually | |||||
| (Internal Clearance) | the direct distance between the | |||||
| Minimum Internal | NA | NA | 4.0 | mm | Measured from input terminals | |
| Tracking (Internal | to output terminals, along | |||||
| Creepage) | internal cavity. | |||||
| Tracking Resistance | CTI | 200 | 200 | 200 | Volts | DIN IEC 112/VDE 0303 Part 1 |
| Isolation Group | IIIa | IIIa | IIIa | Material Group | ||
| (DIN VDE 0110, 1/89, Table 1) | ||||||
| Option 300 - surface | mount classifi cation | is Class A in | accordance | with CECC | 00802. |
订货信息与供货形式
| 型号 | Compliant | Compliant2 | 封装 | Mount | Wing | & | 包装 | 额定值 | EN | 60747-5-2 | 数量 |
|---|---|---|---|---|---|---|---|---|---|---|---|
| Part | RoHS | non RoHS | Surface | Gull | Tape | 1 Minute | IEC/EN/DIN | ||||
| HCPL-0700 | -000E | no option | X | 100 per tube | |||||||
| HCNW138 | -000E | no option | 42 per tube | ||||||||
| column | and combine | with the | desired | option from | |||||||
| Surface | Mount package | in Tape | and Reel | packaging | ANODE | ||||||
| Solder | Refl ow | Temperature | Profi le |
